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Lift-off Equipment - List of Manufacturers, Suppliers, Companies and Products

Lift-off Equipment Product List

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High-pressure jet for high-speed resist stripping! Lift-off equipment for semiconductor manufacturing.

High-pressure jet for high-speed resist stripping! Lift-off equipment for semiconductor manufacturing.

"Removal of metal and resist with ultra-high pressure jet" Achieve lift-off with high-speed processing, high stripping power, and low chemical consumption using the ASAP dedicated nozzle!

This is a super high-pressure jet lift-off device suitable for the difficult patterning of thick films, such as metal and oxide films, that are challenging to etch. Super high-pressure jet lift-off can effectively remove resist that has become difficult to remove due to heat or plasma! In the past, it was easily removed using the DIP process, but it has gradually become harder to remove... In response to the voices of such users, the super high-pressure jet lift-off device was developed! 【Features】 ■ Sprays a super high-pressure jet of up to 20 MPa ■ Removes burrs during lift-off ■ No re-adhesion of metal! ■ No risk of breaking even with thin wafers ■ Can also be used for cleaning resist, polymers, and masks ■ Chemical recycling system (optional) Some companies refer to increasing the pressure of a two-fluid spray as a high-pressure jet, but our super high-pressure jet operates at an impressive 20 MPa! Depending on how it is used, it can even etch glass. Of course, when used correctly in combination with our spin technology, stubborn resist can be easily removed. Additionally, there are no issues with burrs or re-adhesion of metal that can occur with DIP processing! Please consider a demonstration first!

  • Resist Device

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No setup required! Inch-compatible automatic lift-off device.

No setup required! Inch-compatible automatic lift-off device.

Process multiple sizes of wafers without changing setups! The multi-size compatible device achieves high productivity with minimal downtime for lift-off operations!

No need for setup changes due to different wafer sizes, leading to increased productivity! There is a strong demand for different inch sizes depending on the type of product, and a desire to handle larger wafer sizes in the future. Therefore, we offer a lift-off device that can process multiple sizes without the need for setup changes. 【Examples of compatible multiple sizes】 "2-3", "2-4", "3-4", "4-6", "6-8" inches 【Also compatible with thin wafers!】 We often hear concerns that high-pressure jets might break thin wafers (substrates). Our company has a proven track record of lift-off with GaAs wafers of 120um thickness (pressure 3MPa). Pressure adjustments can be freely made depending on the device. 【Benefits of no setup changes for multiple wafer sizes】 ■ Reduced downtime and high operational efficiency ■ Prevents damage to equipment and devices due to adjustment errors after setup changes ■ Reduces processing recipe selection errors with automatic wafer size recognition ■ Burr removal ■ No reattachment of metal Please consider a demonstration first!

  • Resist Device

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Vertical & Spin Leaf Lift-Off Device

Vertical & Spin Leaf Lift-Off Device

Can also be used for organic peeling! Significant reduction in filter load can be achieved with cyclones and composite mesh.

The device is a dedicated single-wafer processing equipment designed to address various issues such as the re-adhesion contamination of a large amount of peeling metal debris generated during the lift-off process. In the peeling dip tank, a combination of downflow/QDR/spray/shower/side US/swing is used, while the cleaning and drying spin single-wafer chamber employs special nozzles/MS rinse/HP-Jet, achieving high-efficiency and uniform short-time lift-off without re-adhesion dirt, resulting in a high-purity substrate surface. 【Features】 ■ Usable for organic peeling as well ■ Significant reduction in filter load with cyclone and composite mesh ■ Over 10 years of delivery records with numerous units supplied to major electronic component manufacturers ■ This system can be replaced with the new "Spin/Dip type" or "UDS type" *For more details, please refer to the PDF materials or feel free to contact us. Wafer, single-wafer cleaning equipment, coating and developing equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, semiconductors, resist stripping equipment, megasonic cleaning equipment, cleaning equipment, resist, photoresist, wafer cleaning equipment, wafer cleaning machines, loaders, unloaders.

  • Other cleaning machines

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Automatic lift-off device (metal resist stripping) Lift-off

Automatic lift-off device (metal resist stripping) Lift-off

Amazing peeling ability with high-pressure jets! Our unique special nozzle enables high-speed processing, high peeling power, and lift-off with low chemical consumption using sheet materials!

Physical and chemical W (double) effect lift-off! What is W effect lift-off? - Delamination using high-pressure jets (MAX 20MPa) with our unique special nozzle for physical force - Delamination using organic solvents such as NMP and DMSO for chemical force Additionally, it achieves high-speed processing, high delamination power, and high stability with sheet processing, while also reducing the amount of chemical solution used. It can also be used as a cleaning device for resist, polymers, and masks, capable of delaminating stubborn resist after thermal treatment or dry etching. Moreover, there is no re-adhesion of burrs or metals, which is a problem in DIP processing. This high-pressure jet lift-off device is suitable for patterning thick films that are difficult to etch, such as thick metal and oxide films. 【Features】 ■ Amazing delamination capability with W (double) effect lift-off! ■ Process stability with sheet-type processing ■ Removal of burrs during lift-off ■ No re-adhesion ■ Temperature-controlled chemical recycling system (optional) *For more details, please refer to the catalog or feel free to contact us.

  • Resist Device
  • Other semiconductor manufacturing equipment

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Leaf-type DIP!? Swelling and high-pressure jet combined lift-off device

Leaf-type DIP!? Swelling and high-pressure jet combined lift-off device

Achieving swelling and high-pressure jet lift-off with high temperature, high peeling force, and low chemical consumption through a recycling-type circulation heater with a sheet-type design comparable to DIP!

Complete removal of stubborn resist that has become difficult to remove with a combination of a leaf-type device for DIP-level swelling and ultra-high pressure jet! ● Stubborn resist can be removed with repeated processing of swelling and high-pressure jet! - Resist that has become difficult to remove after high-temperature baking - Resist after dry etching - Resist deep within fine patterns Additionally, there is no issue with burrs or metal reattachment that can occur with DIP processing! This ultra-high pressure jet lift-off device is ideal for patterning thick films such as thick metal and oxide films that are difficult to etch. ● Compatible with thin wafers! We often hear concerns that high-pressure jets might break thin wafers (substrates). We have a track record of lift-off with GaAs at a thickness of 120um (pressure 3MPa). Pressure adjustments can be freely made depending on the device. 【Features】 ■ Swelling comparable to DIP! ■ Ultra-high pressure jet with MAX 20MPa ■ Repeated processing of swelling and ultra-high pressure jet possible! ■ Burr removal ■ No metal reattachment ■ Usable for cleaning resist, polymers, and masks Please consider a demo first!

  • Resist Device

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New Type SpinDip Processor: Lift-off, Organic Stripping, Deburring

New Type SpinDip Processor: Lift-off, Organic Stripping, Deburring

Practical application of ultrasonic ultrasonic technology mounted on a spin sheet device!

■Rich track record in lift-off and organic peeling processes ■Capable of building systems with wide process margins according to various substrate conditions ■Simultaneous mounting of various peeling/lift-off tools possible Tool selection and combined use possible based on substrate conditions (type/process, etc.) ◎<BLT-type ultrasonic><Horn-type ultrasonic><High-pressure jet><Chemical two-fluid><Multi-spray> ■Equipped with <BLT-type ultrasonic> for low-damage, general-purpose substrate ultrasonic processing ◎BLT-type ultrasonic: Frequency = 38KHz, Vibration amplitude = less than 1μ (P-P) ■Capable of mounting ultra-high amplitude <Horn-type ultrasonic> suitable for robust resist peeling/lift-off ◎Horn-type ultrasonic: Frequency = 38KHz, Vibration amplitude = Max 20μ (P-P) ■Conducting highly uniform ultrasonic processing ◎Standing wave irregularities... theoretically impossible (ultrasonic processing with only direct waves) ◎Irregularities within the ultrasonic vibration surface... strong/weak irregularities above the element (strong) and between elements (weak) are resolved by <substrate rotation> and ultrasonic <scan optimization> ■Application development for burr removal and cleaning after polishing has been implemented *For more details, please refer to the PDF document or feel free to contact us.

  • Semiconductor inspection/test equipment

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Mass production-oriented sheet-type automatic resist stripping and lift-off device "Takada Kogyo Co., Ltd."

Mass production-oriented sheet-type automatic resist stripping and lift-off device "Takada Kogyo Co., Ltd."

A single-layer resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from a high-pressure jet.

A mass production-oriented resist stripping and metal lift-off processing device that combines a standard straight nozzle with a high-pressure jet nozzle. The one-chamber type, which performs resist stripping, lift-off, rinsing, and drying all in one chamber, contributes not only to high throughput but also to a reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off. 【Features】 ■ Unique jet lift-off mechanism with high stripping performance ■ Improved flexibility and reduced running costs to accommodate small quantities of various products and fluctuations in production volume ■ Improved quality and yield through single wafer processing (achieving precise processing without cross-contamination and enhancing uniformity and control across the surface) *For more details, please contact us or download the PDF for further information.

  • High pressure cleaner

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Prototype development of a single-sheet automatic resist peeling and lift-off device "manufactured by Takada Kogyo Co., Ltd."

Prototype development of a single-sheet automatic resist peeling and lift-off device "manufactured by Takada Kogyo Co., Ltd."

A single-layer resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from a high-pressure jet.

A research and development device that combines a standard straight nozzle with a high-pressure jet nozzle, designed for resist stripping and metal lift-off processes for small-scale production. It features a compact design that can be installed in tight spaces (approximately 40% more compact than conventional models). The one-chamber system performs resist stripping, lift-off, rinsing, and drying all in a single chamber, contributing not only to high throughput but also to reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off.*

  • High pressure cleaner
  • Resist Device

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Research and development sheet-type resist stripping and lift-off device "Manufactured by Takada Engineering."

Research and development sheet-type resist stripping and lift-off device "Manufactured by Takada Engineering."

A sheet-type resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from high-pressure jets [testable].

A metal lift-off processing device for research and development that combines a standard straight nozzle with a high-pressure jet nozzle. This model is a compact version of the TWPm, further miniaturized and cost-effective by omitting the transport unit. The one-chamber complete type performs resist stripping, lift-off, rinsing, and drying all in one chamber, contributing not only to high throughput but also to a reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off. 【Features】 ■ 60% reduction in footprint (compared to our TWPm) ■ One-chamber completion ■ Prevention of chemical backflow (patented) ■ Prevention of liquid and mist scattering and reattachment *For more details, please contact us or download the PDF for further information.

  • High pressure cleaner
  • Other semiconductor manufacturing equipment
  • Resist Device

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Short-time peeling! Manual lift-off device (manual machine) Lift-off

Short-time peeling! Manual lift-off device (manual machine) Lift-off

Short-time peeling! With our unique special nozzle, we have achieved high-speed processing, high peeling power, and low chemical consumption for lift-off using high-pressure jets!

Introducing a manual lift-off device that excels in research and development applications! It can shorten long processes, such as lift-off using ultrasound or spray after soaking overnight in acetone or a dedicated stripping solution. By utilizing our unique special nozzle with high-pressure jets, we achieve high-speed processing and strong stripping power with sheet processing, while also reducing the amount of chemical solution used. Furthermore, we have examples where the combination of our unique temperature control swelling and high-pressure jets has reduced processing time from 24 hours to just 3 minutes! In addition to metal and oxide film stripping, it can also be used as a cleaning device for resist, polymers, and masks, capable of stripping stubborn resist after thermal treatment or dry etching. Moreover, there are no issues with burrs or metal reattachment that can occur with DIP processing. This high-pressure jet lift-off device is ideal for patterning thick films, such as thick metal and oxide films, which are difficult to etch. 【Features】 ■ High-pressure jet capable of processing in a short time with a maximum of 20 MPa ■ Removal of burrs during lift-off ■ No metal reattachment ■ Resist stripping is also possible ■ Reduction of scratches with a unique recipe ■ Chemical recycling system (optional) Please consider a demo first!

  • Resist Device

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Semi-Automatic Lift-Off Device (Semi-Auto Lift-Off Machine) Lift-off

Semi-Automatic Lift-Off Device (Semi-Auto Lift-Off Machine) Lift-off

It is a semi-automatic lift-off device that is cheaper than an automatic machine and easier to use than a manual device.

This is a device that automatically transports, lifts off, and rinses just by setting the wafer (substrate). The lift-off process removes burrs with a high-pressure jet from the ASAP special nozzle and performs metal separation. Although it cannot be set with a cassette (carrier), unlike manual processes, it automatically transports each wafer, eliminating concerns about eccentricity or positional misalignment! With dry-in and dry-out processing, operators do not have to worry about chemical residue. The greatest advantage of lift-off is that thick metal can be blown away instantly with a high-pressure jet, making lift-off possible! Our biggest advantage is the combination of temperature-controlled stripping solution and high-pressure jet, which can also strip difficult-to-remove resist. Processes that involve brush cleaning or applying pressure for stripping can be easily replaced with high-pressure jets. [Features] - High-pressure jet lift-off up to 20 MPa - Removal of burrs during lift-off - No reattachment - Combination of temperature control and high-pressure jet - Recycling system for temperature-controlled chemicals (optional) Please feel free to try it out with a free demo!

  • Resist Device

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